Weekly Information of the Global Chip Industry
July 11 – July 17
GLOBALFOUNDRIES and STMicroelectronics confirm chip factory in France
July 11 News, GlobalFoundries and STMicroelectronics announced Monday that they plan to build a chip factory in France, which will create about 1,000 new jobs and support the European Union’s plans to develop more chips. The new French factory is expected to include billions of euros in co-investment, including substantial financial support from the French government, the companies said. The companies said building a factory in France would help the EU reach its goal of producing 20 percent of the world’s chips by 2030. It will also help ST rise to more than $20 billion in revenue.
The first self-calibrating programmable photonic chip is available
On July 12, an international team led by Australian scientists developed the first self-calibrating photonic chip, which can “transform” into a bridge on the data highway, change the current connection between optical chips, and improve the speed of data transmission. , which is expected to promote the development of fields such as artificial intelligence and self-driving cars. The latest research was published in the journal Nature Photonics.
Total global semiconductor equipment sales in 2022, On track to hit a record $117.5 billion
On July 12, SEMI, the international semiconductor industry association, released the “Mid-Year Total Semiconductor Equipment Forecast Report” at SEMICON West 2022 Hybrid, predicting that the total global sales of semiconductor manufacturing equipment by OEMs will reach a record high in 2022. $117.5 billion, up 14.7% from $102.5 billion in 2021. SEMI expects global semiconductor equipment sales to increase to $120.8 billion in 2023.
Micron: Japan’s DRAM factory suffered a sudden power outage on the 8th， Damage is still being assessed
According to news on July 13, Micron, a major memory manufacturer, announced on Tuesday (12th) that its DRAM manufacturing plant in Hiroshima, Japan was affected by severe weather and suffered a sudden power outage on July 8, 2022. After assessing the loss, the production capacity will be gradually increased next week. Micron expects both productivity and wafer scrapping in the fourth quarter of fiscal 2022 and the first quarter of fiscal 2023 to have losses and associated cost impacts.
Ming-Chi Kuo: TSMC will exclusively supply Qualcomm’s 5G flagship chips
On July 14, analyst Ming-Chi Kuo tweeted, “My latest investigation shows that TSMC will be the exclusive supplier of Qualcomm’s 5G flagship chips in 2023 and 2024, which is a super win-win for both companies. situation.” According to Qualcomm’s plan, several Snapdragon 8 and Snapdragon 8+5G flagship chips will be iterated in 2023 and 2024. Starting with the Snapdragon 8+Gen1 chip, Qualcomm began to use the TSMC process to produce 5G flagship chips. Qualcomm Snapdragon 8Gen2 is the successor of Snapdragon 8Gen1. It is expected to be released in November this year. It will be manufactured by TSMC and may still use the 4nm process.
U.S. House of Representatives calls $52 billion chip bill Made ‘significant progress’
July 14 news, according to reports, the chairman of the US House of Representatives Democratic Caucus Hakim Jeffries said Wednesday that a proposed bill to promote the development of the US semiconductor industry has made “significant progress” and he believes that by the end of July An agreement will be reached before. The bill would provide $52 billion in subsidies for chip production and boost technological innovation in the United States.
Google Cloud announces adoption of ARM chips
July 14 News, Alphabet’s Google Cloud unit announced on Wednesday local time that they will start adopting chips based on ARM technology, becoming another large technology company to join the wave of transformation, thereby putting more pressure on Intel and AMD. . Google said the company’s new service will be based on Ampere Computing’s Altra chips. Ampere Computing also sells chips to companies such as Microsoft and Oracle.
TSMC’s second-quarter net profit was NT$237 billion, A year-on-year increase of 76%
It was reported on July 14 that TSMC’s second-quarter net profit was NT$237 billion, a year-on-year increase of 76%, and it was estimated to be NT$219.81 billion. Gross margin in the second quarter was 59.1%, compared to 55.6% in the prior quarter, and an estimate of 56.8%. Operating profit in the second quarter was TWD 262.12 billion, an increase of 80% year-on-year.
Intel to raise prices on multiple chips this fall, Some may increase in price by more than 20%
July 14 news, according to reports, Intel has told customers that it will increase the price of most microprocessors and peripheral chip products this fall, mainly due to rising production and material costs.
Intel plans to raise prices this fall on flagship products such as servers and PC processors, as well as on a range of other products, including Wi-Fi and other connectivity chips, three industry executives said. Intel told customers that the price hike was necessary due to soaring production and material costs. Different types of chips may vary, with increases ranging from single digits to more than 10% and 20% in some cases, one of the people said, with increases that have not yet been finalized.
SK hynix plans to cut capex in 2023 to nearly $12.2 billion
On July 15, people familiar with the matter revealed that SK Hynix, the world’s second-largest memory chip maker, is considering cutting its capital expenditure by about a quarter to 16 trillion won (about 12.2 billion U.S. dollars) in 2023 to meet demand for electronic products. slower than expected. SK Hynix is basically on track to spend about 21 trillion won this year to build DRAM and NAND production capacity, people familiar with the matter said. However, uncertainty over falling demand for chips in various fields such as smartphones and servers has forced the company to reconsider its expansion plans for next year.
Samsung will start with DDR6 memory, Application of improved semi-additive packaging technology
On July 15, according to Korean electronic media reports, Younggwan Ko, deputy director of Samsung Electronics Test and System Package (TSP), said at a seminar that Samsung’s competitors have begun to use MSAP (modified semi-additive method) packaging from DDR5 memory. technology, Samsung will apply MSAP packaging technology in DRAM production starting from DDR6. In MSAP, the areas other than the circuit are coated and the voids are plated, making the circuit finer. As memory chip capacities and data processing speeds increase, packages must be designed to suit the situation, the deputy director said.
The unit price of silicone DMC fluctuates slightly, Price stabilized at 21000
Last week, most of the silicone companies were in the stage of digesting inventory. The mainstream monomer factories maintained stability under the support of pre-sale orders, so there was no willingness to make profits. On the 14th, some monomer factories in Shandong unexpectedly lowered their quotations, and on the 15th they opened and fell again. 200, DMC reported 20,400 yuan / ton. On this basis, the silicone market has a strong wait-and-see atmosphere, and bearish sentiment has resumed.
DMC is an important raw material to ensure the stability of silicone. At present, the supply and demand of DMC are basically stable, and the production capacity of DMC of major brands is relatively sufficient, which can meet the global demand for materials. The mainstream quotation is 20.6-21.5 yuan/KG.
Media news, affected by the acceleration of downstream infrastructure investment, the current market demand for silicone cables is relatively strong. Many domestic silicone cable companies said that the current order situation is relatively full, and the capacity utilization rate is relatively high. Some product orders of some companies have been scheduled until the end of the third quarter.